Active Thermal Surface – ATS
The principle behind ATS is direct thermal transfer to the device under test.
An application specific heater elevates the temperature of a copper mass. Designed for reliability testing, the gold over nickel plated copper includes individual mating bosses for device headers. These bosses are the Active Thermal Surface(s) or ATS.
Our design applies heat directly to your device and holds the tem
perature to within +/- .5°C of your programmed set-point.
We have custom high-temperature interconnects which hold the DUT package onto the ATS and provide a means of connecting your electrical bias and data acquisition hardware.
REL-West applies the ATS technology into reliability test systems configured for up to 200 sites. We also deploy this technology in smaller benchtop systems; perfect for discrete test applications and academic or institutional settings.